The purpose of thermal paste (also known as thermal compound or thermal grease) between a CPU (Central Processing Unit) and a heat sink is to improve the thermal conductivity and transfer of heat between the two surfaces.
When a CPU operates, it generates heat due to the flow of electrical current through its circuits. This heat needs to be efficiently dissipated to prevent the CPU from overheating, which can cause performance issues or even damage to the processor.
The interface between the CPU and the heat sink is not perfectly smooth. There are microscopic imperfections, air gaps, and unevenness on both surfaces. These irregularities can hinder the transfer of heat effectively. When thermal paste is applied, it fills in these gaps and improves the contact between the CPU and the heat sink.
Thermal paste is a material with high thermal conductivity. It typically consists of a mixture of substances like silicone, metal oxides, or ceramics. When the thermal paste is applied, it forms a thin, even layer between the CPU and the heat sink, ensuring better thermal contact.
The thermal paste helps to bridge the small gaps between the CPU and heat sink, eliminating air pockets and maximizing the transfer of heat from the CPU to the heat sink. It enhances the conduction of heat by filling in the irregularities, promoting more efficient dissipation of heat into the heat sink.
Overall, the purpose of thermal paste is to improve thermal transfer and maintain lower CPU temperatures, which is crucial for the proper functioning and longevity of the CPU.